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Chengdu High Tech Comprehensive Bonded Area: First among China in terms of total import and export

Source:sc.china.com.cn Date:2020-04-01 18:11:25Editor:刘婷婷

On March 13, Chengdu Customs released the data of Sichuan's foreign trade import and export from January to February this year. In the first two months of the year, Chengdu High Tech Comprehensive Bonded Area achieved import and export of 67.27 billion yuan, ranking first in the national comprehensive bonded area, with a year-on-year growth of 19.7%, which is the first in the country for 23 consecutive months.

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Chengdu Hi-tech Comprehensive Bonded Zone

Data shows that from January to February this year, Sichuan achieved a total import and export value of 97.8 billion yuan, ranking 10th in the country in terms of import and export scale, an increase of 8.3% over the same period last year, of which Chengdu reported an import and export value of 86.72 billion yuan, an increase of 13.1% over the same period last year. The year-on-year growth rate of foreign trade in Sichuan and Chengdu is higher than that of the whole country in the same period, showing a growth trend.

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Chengdu Hi-tech Comprehensive Bonded Zone

In 2019, Chengdu High Tech Comprehensive Bonded Area achieved a total import and export volume of 433 billion yuan, becoming the only comprehensive bonded area in China to break the 400 billion yuan record. Among that, the import and export of high tech park of Chengdu High Tech Comprehensive Bonded Area reached 382.7 billion yuan, an increase of 24% year on year, accounting for 57% of the total import and export volume of Sichuan Province. In April 2018, the import and export volume of Chengdu High Tech Comprehensive Bonded Area ranked first in the country for the first time among 74 comprehensive bonded areas. It has maintained the lead to this day.

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Chengdu Electronic Information Industrial Area

Chengdu High Tech Comprehensive Bonded Area is located in the Western Park of Chengdu high tech area, which was approved in 2010 and became functional in 2011. Up to now, there are nearly 40 enterprises located in Chengdu high tech comprehensive bonded area, including high-end manufacturing enterprises such as Intel, Texas Instruments, Dell, Foxconn, MOLEX, etc., with an 8-inch wafer production line and six packaging and testing plants, and internal and external linkage, forming a relatively complete integrated circuit industry chain composed of IC design, wafer manufacturing, packaging and testing and supporting projects. At the same time, Apple, Dell's tablet, laptop and other intelligent terminal products are also produced here. The area is becoming an important production base of tablet and notebook computers in the world. In addition, there are five aviation precision instrument manufacturing enterprises and one FDA certified R & D and pharmaceutical enterprise in the area.

At present, Chengdu High Tech Comprehensive Bonded (Hi-tech Park) is fully operational.(By Edina Liang)